SASinno Ant-i1 kompakte Offline selective soldering systemOffline · Selective soldering

Offline selective soldering system

Ant-i1

A compact entry into automated offline selective soldering.

The Ant-i1 is a compact standalone system for small and medium-sized assemblies. A drop-jet fluxer, bottom IR preheating, one soldering station and live process monitoring support a controlled offline process.

Understand selective soldering ↗

350 × 260mm PCB format
1 mechanical pump · 1 drop-jet fluxerRequest a system

The equipment makes
the difference.

Ant-i1: compact process technology for changing assemblies and offline operation.

Standard equipment

9 features

1 mechanical solder pump

One lead-free-compatible titanium solder pot with a mechanical pump directs solder to the programmed joints.

1 drop-jet fluxer

Flux is applied locally and in a controlled manner to the defined areas of the assembly.

Bottom IR preheating

Bottom preheating prepares the PCB, components and flux thermally for soldering.

Nitrogen heating

Heated nitrogen supports the process atmosphere directly at the nozzle.

Automatic wave-height calibration

The system supports repeatable adjustment of the solder-wave height.

Live camera

The soldering process can be monitored on screen during operation.

Servo-controlled X/Y/Z axes

The motion axes guide the fluxer and soldering process along the programmed paths.

Industrial PC

Programs, solder points and travel paths are created and managed on the integrated user interface.

Maintenance and traceability

The software supports maintenance information and manufacturing-process documentation.

Options & configuration

2 features

Top convection preheating

Additional top preheating can be configured for thermally demanding assemblies.

Custom nozzles

Nozzle geometry is selected according to joint locations, component clearances and access.

The specific equipment and utility requirements are defined in the quotation for the assembly and application.

The facts.
At a glance.

Technical data for the documented base configuration. Power supply and solder-pot capacity are confirmed for the project.

PCB
50 × 50 to 350 × 260 mm
Long format with 180° rotation
up to 700 × 260 mm
Fluxer / solder pot / pump
1 / 1 / 1
Nitrogen consumption
1.5 m³/h per nozzle
Operating / maximum power
4 / 6.5 kW
Dimensions W × D × H
990 × 1,308 × 1,714 mm
Weight
400 kg
Compressed air / exhaust
3–5 bar / 200 m³/h
Wave-height calibration
Automatic

A clear view of fluxing and soldering.

The process views show local flux application and the monitored soldering area of the Ant-i1.

Assess application and integration.

PCB format is the first filter. Access, thermal demand and required cycle time determine actual suitability.

Application

The compact offline cell suits prototypes, NPI, small batches and changing assemblies with defined through-hole joints.

Integration

Loading and unloading are manual. Utilities, extraction, support or carrier and nozzle selection are matched to the assembly.

Limits and sample trial

One fluxer and one solder pump process the programmed locations sequentially. Cycle time, wetting, thermal profile and component limits must be checked on a sample.

More details for your planning.

You can obtain manuals, equipment details and project-specific information directly from our team.

Request documentation

Knowledge from practice

What prepares a good solder joint.

Fluxing, preheating and soldering: learn about the three process steps and their key influencing factors.

Read the article

Your assembly.
Our next conversation.

Let us discuss whether the Ant-i1 suits your process.

Request Ant-i1