SASinno Ant-i2 Offline selective soldering system mit zwei PumpenOffline · Selective soldering

Offline selective soldering system

Ant-i2

Two parallel solder waves in a compact offline cell.

The Ant-i2 combines one solder pot with two separate pumps and wave tunnels. It can process two smaller assemblies in parallel or one larger PCB in a standalone cell.

Understand selective soldering ↗

350 × 450mm for one PCBor two PCBs, each up to 350 × 215 mm
2 mechanical pumps · 2 drop-jet fluxersRequest a system

The equipment makes
the difference.

Ant-i2: two separate solder waves for parallel tasks or larger PCBs.

Standard equipment

9 features

2 mechanical solder pumps

Two separate pumps and wave tunnels operate from one lead-free-compatible titanium solder pot.

2 drop-jet fluxers

Each process receives targeted flux application for the defined areas of the assembly.

5 kW bottom IR preheating

Bottom preheating prepares the PCB, components and flux for soldering.

Nitrogen heating at both nozzles

Heated nitrogen supports the process atmosphere at both soldering positions.

Automatic wave-height calibration

Both solder waves are monitored and calibrated for the process.

Live process monitoring

Both soldering processes can be monitored on screen during operation.

Solder-level alarm

The system monitors the level of the shared solder pot.

Servo-controlled X/Y/Z axes

According to the manufacturer, the motion axes achieve a positioning accuracy of ±0.05 mm.

Industrial PC and process software

Programs, maintenance information and traceability data are managed on the integrated user interface.

Options & configuration

2 features

Top convection preheating

Additional top preheating can be configured for thermally demanding assemblies.

Custom nozzles

Nozzle diameter and geometry are selected according to joint locations, component clearances and access.

The specific equipment and utility requirements are defined in the quotation for the assembly and application.

The facts.
At a glance.

Technical data for the documented base configuration. Parallel processing capability is checked with sample assemblies.

One PCB
50 × 50 to 350 × 450 mm
Two PCBs in parallel
each 50 × 50 to 350 × 215 mm
Fluxers / solder pot / pumps
2 / 1 / 2
Nitrogen consumption
3 m³/h total
Operating / maximum power
7 / 13 kW
Dimensions W × D × H
1,260 × 1,640 × 1,895 mm
Weight
550 kg
Compressed air / exhaust
3–5 bar / 200 m³/h
Solder-pot capacity
35 kg

Controlled operation of two processes.

The process views show the soldering area and local flux application of the Ant-i2.

Assess application and integration.

The Ant-i2 combines parallel processing with a larger single-PCB format. Layout, nozzle access and process time determine the appropriate operating mode.

Application

The offline cell suits two comparable soldering tasks in parallel or one larger PCB with defined through-hole joints.

Integration

Loading and unloading are manual. Utilities, extraction, fixturing and the spacing of both processes are defined for the assembly.

Limits and sample trial

Both pumps use one shared solder pot. Nozzle access, heat input, wetting and achievable cycle time must be confirmed with sample assemblies.

More details for your planning.

You can obtain manuals, equipment details and project-specific information directly from our team.

Request documentation

Knowledge from practice

What prepares a good solder joint.

Fluxing, preheating and soldering: learn about the three process steps and their key influencing factors.

Read the article

Your assembly.
Our next conversation.

Let us discuss whether the Ant-i2 suits your process.

Request Ant-i2